selective plating
英 [sɪˈlektɪv ˈpleɪtɪŋ]
美 [sɪˈlektɪv ˈpleɪtɪŋ]
网络 局部电镀; 选择性电镀; 选镀
双语例句
- The Application of Selective Plating Technique in Repairing Components of Port Machinery
电刷镀技术在港机零件修复中的应用 - Selective supplementary medial buttress plating combined with less invasive stabilization system in the treatment of complex tibial plateau fractures
选择性内侧辅助固定结合微创内固定系统治疗复杂胫骨平台骨折 - A comparison of SS and he selective plating media for isolation of Salmonella from foods
SS和HE琼脂平板在食品沙门氏菌检验中的应用 - Because of the particularity of the selective plating process the hydrogen proton screening effect of defects in the layer was not observed by measuring the parameters of positron annihilation.
由于快速Ni电刷镀层制备工艺的特殊性，正电子湮没参数在该种材料中反映不出氢质子的屏蔽行为。 - The Mechanism of Selective Electroless Copper Plating Micro-pattern on Ceramics Without Sensitisation and Activation
陶瓷表面无敏化活化微细镀覆机理研究 - In this paper, the metal distribution in selective pulse plating is investigated.
研究了选择性脉冲电镀中的金属分布规律，以局部酸性镀铜为例讨论了脉冲峰值电流密度和工作比对铜镀层金属分布的影响。 - Technology of selective electroless nickel plating& gold immersion for printed circuit board
印刷线路板中的选择性化学镍金技术 - The results show that the selective gold plating of the above mentioned packages could be implemented successfully with the combination of the fractional electroless and electroplating under suitably controlled plating conditions.
结果表明：采用分步化学镀和电镀相结合的方法，适当控制化学镀和电镀工艺条件，可以成功地实现上述封装的局部镀金。 - Selective chelatometric determination of Pb with sodium molybdate as releasing agent and its practical application in determination of Pb content in Pb alloy deposit, Pb-Sn-Cu alloy deposit and their plating solutions are described.
论述了以钼酸钠作释放剂选择性螫合液定法测定铅的方法，应用于测定铅基合金镀层、Ph－Sn&Cu合金镀层和电镀溶液中铅的含量。 - Finally, the micro-pattern on the surface of semi-conductor silicon is made and selective metal film is obtained by making use of the YAG pulse laser and electroless plating.
最后，利用YAG脉冲激光和化学镀的方法在半导体硅表面制备了微型结构图元，实现了金属有选择成膜。 - Selective gold plating suitable to the frame of integrated circuit and the newly developed pulse gold plating are also reviewed.
介绍了酸性镀金、中性镀金、碱性镀金和无氰镀金等四种镀金工艺以及适用于集成电路框架的选择性镀金和最近新发展起来的脉冲镀金。 - Application of pulsed current in selective plating
脉冲电流在选择性电镀中的应用 - Mechanism, procedures and operation parameters of selective electroless nickel plating and gold immersion ( SENi/ IG) were introduced.
介绍了选择性化学镀镍、浸金工艺的原理、流程和操作参数。 - In review of development of selective plating equipment, advantages and disadvantages of main kinds of high speed selective plating machines now used are analyzed and suggestions for their Chinese nationalization given. ( p.27-29)
概述了选择性电镀设备的发展过程，详细介绍了目前各种类型的高速选择镀设备，分析其优点与不足，提出了国产化的建议。 - A study of defects and hydrogen behavior in the high-speed Ni selective plating layer by positron annihilation
快速Ni电刷镀层中缺陷与氢行为的正电子湮没研究 - Dyspeptic patients with visceral hypersensitivity: Sensitisation of pain specific or multimodal pathways? Selective Electroless Copper Plating Micro-pattern on Ceramics Without Sensitisation and Activation
内脏高敏感性消化不良患者的痛觉过敏：疼痛特异性通路抑或多模式通路的致敏作用？陶瓷表面无敏化活化法微细化学镀铜 - Selective Electroless Plating of Copper by Laser and a Mathematical Model for Deposition
激光诱导选择性化学镀铜及沉积过程的数值模拟 - Selective Chelatometric Determination of CuSO_4 in Copper Plating Solution
选择性螯合滴定法测定酸铜镀液中的CuSO4 - The Grain Size of the Layers of High Speed Selective Brushing Plating
高速选择性金属涂镀层的晶粒大小